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Quality is key: Infineon ships world’s first industrial-grade eSIM in miniaturized package - Cerebral-Overload
MUNICH, Dec. 12, 2018 /PRNewswire/ -- Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. For taking full advantage of the ubiquitous mobile networks, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides the world's first industrial-grade embedded SIM (eSIM) in a miniature Wafer-level Chip-scale Package (WLCSP). Manufacturers of industrial MUNICH, Dec. 12, 2018 /PRNewswire/ -- Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. For taking full advantage of the ubiquitous mobile networks, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides the world's first industrial-grade embedded SIM (eSIM) in a miniature Wafer-level Chip-scale Package (WLCSP). Manufacturers of industrial