Circuit Board

Press Releases

Dymax Introduces Multi-Cure(R) 9037-F Encapsulant for Printed Circuit Board Assembly

TORRINGTON, Conn., July 20, 2020 /PRNewswire/ — Dymax Corporation expands its range of encapsulant materials with the introduction of Multi-Cure® 9037-F. The product cures in seconds upon exposure to UV/Visible light and has secondary heat cure for shadow areas caused by high-profile components on printed circuit boards. 9037-F Blue Fluorescing Encapsulant The material features improved flexibility and resiliency for a variety of glob-top, chip-on-board,…