DEEPX
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CES 2026
DEEPX Unveils Vision as a “Physical AI Infrastructure Company” at CES 2026
Seoul, South Korea – December 30, 2025 – DEEPX, a global leader in ultra-low-power, high-performance AI semiconductors, announced today that it will unveil its strategic vision to become a foundational “Physical AI Infrastructure Company” at CES 2026 in Las Vegas. At CES 2026, DEEPX will present a new paradigm for AI infrastructure—one designed for the physical world. As AI…
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CES 2026
DEEPX Launches DX-H1 V-NPU: The 30W Single-Card Solution That Challenges GPU Dominance
Ahead of CES 2026, DEEPX, a pioneer in ultra-low-power on-device AI semiconductors, today announced the official launch of the DX-H1 vision neural processing unit (V-NPU), a dedicated video intelligence chipset capable of processing hundreds of AI video channels at just 30W. Redefining Video AI Infrastructure The DX-H1 V-NPU is an all-in-one video intelligence solution combining a multi-channel engine capable of decoding,…
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Press Releases
Hyundai Motor, Kia’s Robotics LAB and DEEPX Begin Commercialization for Next-Generation On-Device AI Robot Platform
DEEPX, an ultra-low-power on-device AI semiconductor company, is unveiling a next-generation robot intelligence platform co-developed with Hyundai Motor and Kia’s Robotics LAB. The controller platform has now progressed into the commercial validation stage for real-world deployment, in preparation for future mass-production, marking a key milestone toward the commercialization of Physical AI — enabling robots to operate autonomously without reliance on cloud connectivity. DEEPX’s…
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CES 2026
DEEPX Wins Two CES 2026 Innovation Awards; Its DX-M1 Powers Best of Innovation Winner ALPON X5 by Sixfab
Global AI semiconductor company DEEPX (CEO Lokwon Kim) announced that it has won two CES 2026 Innovation Awards, while Sixfab, a US-based IoT and edge computing company, received the Best of Innovation award — CES’s highest honor — for its AI gateway ALPON X5 powered by DEEPX’s DX-M1. This milestone demonstrates how DEEPX’s solutions are further solidifying its position as the global standard for ‘Physical AI’ while…
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CES 2025
DFI and DEEPX Unveil Revolutionary Edge AI at CES 2025 to Power Smart Cities and Industries
DFI, a global leader in embedded motherboards and industrial computers, will join DEEPX at CES 2025 to unveil new industrial edge AI platforms integrated with the DX-M1 AI accelerator, targeting smart city applications. This collaboration reflects a shared commitment to advancing on-device and application-specific AI, paving the way for a more flexible, efficient, and sustainable edge AI adoption. DFI and…
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CES 2024
DEEPX’s DX-M1 Chip Recognized at CES 2024 as Leading AI of Things Solution
World’s only AI accelerator that combines low power, high performance, high efficiency, and cost-effectiveness hits new milestone of deployment to over 40 global companies – DX-M1 AI chip has surpassed 40 global customers who are trialing it as part of DEEPX’s Early Engagement Customer Program, which has garnered significant interest from companies across robotics, autonomous vehicles, factory automation, AI-powered security…
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CES 2024
DEEPX Making High-Performance, Low-Power AI Servers A Reality with DX-H1 Launch at CES 2024
DEEPX (CEO, Lokwon Kim), an original AI semiconductor technology company, is set to make waves at CES 2024 by introducing the DX-H1 — a cutting-edge PCIe card designed to accelerate AI server performance while reducing energy consumption. Honored with the CES 2024 Innovation Award in the Computer Hardware and Components category, DX-H1 is widely anticipated to attract significant attention as it…
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