by Ben | Jul 12, 2023 | Press Releases
MediaTek today officially launched its new Dimensity 6000 series along with a chipset designed to enhance the next generation of mainstream 5G devices. The Dimensity 6100+ SoC delivers premium features—including exceptional power efficiency, vivid displays,...
by Ben | Feb 11, 2020 | Press Releases
SHENZHEN, China, Feb. 5, 2020– ZTE Corporation (0763.HK / 000063.SZ), a major international provider of telecommunications, enterprise and consumer technology solutions for the mobile Internet, today officially announced that a series of new 5G terminal devices...
