by Ben | Oct 31, 2023 | Press Releases
-AppleĀ® today announced M3, M3 Pro, and M3 Max, three chips featuring groundbreaking technologies that deliver dramatically increased performance and unleash new capabilities for MacĀ®. These are the first personal computer chips built using the industry-leading...
by Ben | Dec 11, 2020 | Press Releases
SEATTLE–(BUSINESS WIRE)–Dec. 10, 2020– Today, Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), announced that Arm, a global leader in semiconductor design and silicon intellectual property development...
by Ben | Feb 6, 2020 | Press Releases
SANTA CLARA, Calif., Feb. 4, 2020 /PRNewswire/ — Marvell (NASDAQ: MRVL) today announced its dual 400GbE (Gigabit Ethernet) MACsec PHY transceiver with 256-bit encryption and Class C compliant precision time protocol (PTP) timestamping, bringing...