by Ben | Jan 21, 2021 | Press Releases
HSINCHU, Jan. 20, 2021 /PRNewswire/ — MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6nm...
by Ben | Jan 7, 2020 | CES 2020, Press Releases
LAS VEGAS, Jan. 2, 2020 /PRNewswire/ — 3NOD Acoustilink® Incorporated announced during the Consumer Electronics Show (CES 2020 ) its next generation turnkey soundbar platform that leverages Synaptics’ AudioSmart AS371 SoC with integrated voice...
by Ben | May 31, 2019 | Press Releases
TAIPEI, Taiwan, May 29, 2019 /CNW/ — Today at COMPUTEX, MediaTek revealed its full 5G readiness with the introduction of its groundbreaking 5G chipset, a multi-mode, 7nm 5G system-on-chip (SoC) designed to power the first wave of high-end 5G smartphones....
by Ben | Apr 25, 2019 | Press Releases
At the Taiwan Embedded Forum, AMD (NASDAQ: AMD) announced the Ryzen™ embedded product family is growing with the new AMD Ryzen™ Embedded R1000 SoC. Building upon the success of the Ryzen™ Embedded V1000 SoC, the AMD Ryzen Embedded R1000 SoC provides...
by Ben | Jan 24, 2019 | Press Releases
Synopsys, Inc. (Nasdaq: SNPS) today announced the new DesignWare® ARC® EM Software Development Platform to accelerate software development and debug of ARC EM processor-based system-on-chips (SoC) for a wide range of ultra-low power...